WEIWANG / APPLICATION & DEVELOPMENT

Micron-scale High-speed Crack Inspection

Plan high-speed inspection of visible cracks, edge chips, missing corners and broken parts in semiconductor and TFT processes. Establish stable defect contrast before optimizing processing and line timing.

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Visible diagonal crack crossing bright and dark patterned regions
Application image. Performance depends on validation conditions.

Define each defect type

A crack, an edge chip and a missing piece have different appearance characteristics. Define the defect categories and acceptance rules separately, rather than treating all breakage as a single condition.

  • Visible surface cracks and continuity
  • Edge chipping and missing corners
  • Broken-part presence and defect-region reporting

What does micron-scale mean?

A micrometre, written μm, is a unit of length. Specify whether the requirement concerns defect width, length, detection probability or measurement accuracy. Pixel size alone does not establish a detection limit.

  • Define field of view and physical pixel scale
  • Assess contrast across bright and dark patterns
  • Validate borderline defects and false rejects

Optimize the complete inspection cycle

High-speed operation involves exposure, image transfer, processing and equipment communication. Focus on valid ROIs and exclude irrelevant background before evaluating candidate regions.

  • Measure acquisition, processing and result output separately
  • Review ROI size and data volume
  • Match handshakes to actual part handling

Recognize optical inspection limits

Internal cracks or defects without visible optical contrast may require a different inspection method. Minimum detectable size, accuracy and throughput must be verified with calibrated samples and the intended setup.

Frequently asked questions

Does the photograph prove a specific μm limit?

No. Calibration, known defect samples and validation records are required. The image illustrates visible crack contrast.

Is a fixed parts-per-second rate implied?

No. Cycle time depends on exposure, field of view, data volume, processing and equipment communication.